Tapes for protection of semiconductor wafers during the back-grinding process.
UV, Heat & Peel Releasing Adhesive Tapes.
Tape for Bumped Wafers
Bumped Wafers requires to have excellent bump protection performance during back grinding, the bumps will be the source of stress concentration。The tape needs to have a thicker layer of the adhesive-compliant to accommodate gold-bumped and solder-bumped wafers for accurate and stress-free thinning。
Tapes are designed for holding semiconductor wafers or package during the dicing process.
Tapes Available for Following Processes
Stealth Laser Dicing
Expandable Tape for Stealth Dicing
Backside Stealth Laser Dicing Through Tape
This tape has the functional combination of dicing tape and die-attach film. It has an additional layer of die-attach material compared to conventional dicing tape which helps combine the die-attach with the dicing process.